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NCP2990 1.3 Watt Audio Power Amplifier with Fast Turn On Time
The NCP2990 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2990 is capable of delivering 1.3 W of continuous average power to an 8.0 W BTL load from a 5.0 V power supply, and 1.0 W to a 4.0 W BTL load from a 3.6 V power supply. The NCP2990 provides high quality audio while requiring few external components and minimal power consumption. It features a low-power consumption shutdown mode, which is achieved by driving the SHUTDOWN pin with logic low. The NCP2990 contains circuitry to prevent from "pop and click" noise that would otherwise occur during turn-on and turn-off transitions. It is a zero pop noise device when a single ended audio input is used. For maximum flexibility, the NCP2990 provides an externally controlled gain (with resistors), as well as an externally controlled turn-on time (with the bypass capacitor). When using a 1 mF bypass capacitor, it offers 60 ms wake up time. Due to its superior PSRR, it can be directly connected to the battery, saving the use of an LDO. This device is available in a 9-Pin Flip-Chip CSP (Lead-Free).
Features http://onsemi.com MARKING DIAGRAMS
9-Pin Flip-Chip CSP FC SUFFIX 1 CASE 499E
A3
MBAG AYWW C1 A1
MBA A Y WW G
= Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package
PIN CONNECTIONS
9-Pin Flip-Chip CSP A1 INM B1 VM_P C1 BYPASS A2 OUTA B2 VM C2 A3 INP B3 Vp C3
* * * * * * * * * *
1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply Superior PSRR: Direct Connection to the Battery Zero Pop Noise Signature with a Single Ended Audio Input Ultra Low Current Shutdown Mode: 10 nA 2.2 V-5.5 V Operation External Gain Configuration Capability External Turn-on Time Configuration Capability: 60 ms (1 mF Bypass Capacitor) Up to 1.0 nF Capacitive Load Driving Capability Thermal Overload Protection Circuitry This is a Pb-Free Device*
OUTB SHUTDOWN (Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet.
Typical Applications
* Portable Electronic Devices * PDAs * Wireless Phones
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
1
September, 2006 - Rev. 0
Publication Order Number: NCP2990/D
NCP2990
Rf 20 kW Cs Ci 47 nF Ri 20 kW Vp 1 mF
AUDIO INPUT
INM INP Vp
- +
Vp
OUTA R1 20 kW R2 20 kW OUTB
8W
BYPASS Cbypass 1 mF SHUTDOWN VIH VIL VM_P
- +
SHUTDOWN CONTROL VM
Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input
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NCP2990
PIN DESCRIPTION
Pin A1 A2 A3 B1 B2 B3 C1 C2 C3 Type I O I I I I I O I Symbol INM OUTA INP VM_P VM Vp BYPASS OUTB SHUTDOWN Description Negative input of the first amplifier, receives the audio input signal. Connected to the feedback resistor Rf and to the input resistor Rin. Negative output of the NCP2990. Connected to the load and to the feedback resistor Rf. Positive input of the first amplifier, receives the common mode voltage. Power Analog Ground. Core Analog Ground. Positive analog supply of the cell. Range: 2.2 V-5.5 V. Bypass capacitor pin which provides the common mode voltage (Vp/2). Positive output of the NCP2990. Connected to the load. The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating Supply Voltage Operating Supply Voltage Input Voltage Max Output Current Power Dissipation (Note 2) Operating Ambient Temperature Max Junction Temperature Storage Temperature Range Thermal Resistance Junction-to-Air ESD Protection Human Body Model (HBM) (Note 4) Machine Model (MM) (Note 5) Symbol Vp Op Vp Vin Iout Pd TA TJ Tstg RqJA - Value 6.0 2.2 to 5.5 V 2.0 V = Functional Only -0.3 to Vcc +0.3 500 Internally Limited -40 to +85 150 -65 to +150 (Note 3) 8000 >250 Unit V - V mA - C C C C/W V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25C. 2. The thermal shutdown set to 160C (typical) avoids irreversible damage on the device due to power dissipation. 3. The RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195C/W with 50 mm2 total area and also 135C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation. 4. Human Body Model, 100 pF discharge through a 1.5 kW resistor following specification JESD22/A114. 5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
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NCP2990
ELECTRICAL CHARACTERISTICS Limits apply for TA between -40C to +85C (Unless otherwise noted).
Characteristic Supply Quiescent Current Symbol Idd Conditions Vp = 2.6 V, No Load Vp = 5.0 V, No Load Vp = 2.6 V, 8 W Vp = 5.0 V, 8 W Common Mode Voltage Shutdown Current Shutdown Voltage High Shutdown Voltage Low Turning On Time (Note 8) Turning Off Time Output Impedance in Shutdown Mode Output Swing Vcm ISD VSDIH VSDIL TWU TOFF ZSD Vloadpeak - - Cby = 1 mF - - Vp = 2.6 V, RL = 8.0 W Vp = 5.0 V, RL = 8.0 W (Note 7) TA = +25C TA = -40C to +85C Vp = 2.6 V, RL = 4.0 W THD + N < 0.1% Vp = 2.6 V, RL = 8.0 W THD + N < 0.1% Vp = 5.0 V, RL = 8.0 W THD + N < 0.1% Vp = 5.0 V, RL = 8.0 W Vp = 2.6 V Vp = 5.0 V Vp = 2.6 V, G = 2.0 10 Hz < F < 20 kHz Vp = 5.0 V, G = 10 10 Hz < F < 20 kHz G = 2.0, RL = 8.0 W Vpripple_pp = 200 mV Cby = 1.0 mF Input Terminated with 10 W F = 217 Hz Vp = 4.2 V Vp = 3.6 V Vp = 3.0 V F = 1.0 kHz Vp = 4.2 V Vp = 3.6 V Vp = 3.0 V Efficiency Thermal Shutdown Temperature (Note 9) Total Harmonic Distortion h Tsd THD Vp = 2.6, F = 1.0 kHz RL = 4.0 W, AV = 2.0 PO = 0.32 W Vp = 5.0 V, F = 1.0 kHz RL = 8.0 W, AV = 2.0 PO = 1.0 W 6. 7. 8. 9. Min/Max limits are guaranteed by design, test or statistical analysis. This parameter is guaranteed but not tested in production in case of a 5.0 V power supply. See page 9 for a theoretical approach of this parameter. For this parameter, the Min/Max values are given for information. Vp = 2.6 V, Porms = 320 mW Vp = 5.0 V, Porms = 1.0 W - Min (Note 6) - - - - - - 1.2 - - - - 1.6 4.0 3.85 - Typ 1.5 1.7 1.7 1.9 Vp/2 0.02 - - 60 1.0 10 2.20 4.50 0.40 0.30 - 1.20 - -30 - - 84 77 - 0.65 30 - - dB W mV dB - - W Max (Note 6) 4 5.5 - 0.3 - 0.4 - - - - - V mA V V ms ms kW V Unit mA
Rms Output Power
PO
Maximum Power Dissipation (Note 8) Output Offset Voltage Signal-to-Noise Ratio
PDmax VOS SNR
Positive Supply Rejection Ratio
PSRR V+
- - -
-74 -72 -73
- - -
- - - - - 140 - - - - - -
-80 -76 -77 48 63 160 - 0.04 - - 0.02 -
- - - - - 180 - - - - - - % C %
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NCP2990
TYPICAL PERFORMANCE CHARACTERISTICS
10 VP = 2.5 V RL = 8 W f = 1 kHz THD + N (%) THD + N (%) 1 1 10 VP = 3.0 V RL = 8 W f = 1 kHz
0.1
0.1
0.01 0
50
100
150
200
250
300
350
0.01
0
100
200
300 POUT (mW)
400
500
POUT (mW)
Figure 2. THD+N versus Output Power
Figure 3. THD+N versus Output Power
10 VP = 3.6 V RL = 8 W f = 1 kHz THD + N (%) THD + N (%) 1
10 VP = 4.2 V RL = 8 W f = 1 kHz 1
0.1
0.1
0.01 0
100
200
300
400
500
600
700
800
0.01
0
200
400
600 POUT (mW)
800
1000
POUT (mW)
Figure 4. THD+N versus Output Power
Figure 5. THD+N versus Output Power
10 VP = 5.0 V RL = 8 W f = 1 kHz THD + N (%) THD + N (%) 1
10 VP = 2.5 V RL = 4 W f = 1 kHz 1
0.1
0.1
0.01 0
200
400
600
800
1000 1200
1400 1600
0.01
0
100
200
300 POUT (mW)
400
500
POUT (mW)
Figure 6. THD+N versus Output Power
Figure 7. THD+N versus Output Power
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NCP2990
TYPICAL PERFORMANCE CHARACTERISTICS
1600 1400 OUTPUT POWER (mW) 1200 1000 800 600 400 200 2.5 0.01 100 THD+N = 10% THD+N (%) RL = 8 W f = 1 kHz 1 VP = 2.5 V RL = 8 W POUT = 100 mW
0.1
THD+N = 1%
3
3.5
4
4.5
5
1000 FREQUENCY (Hz)
10000
POWER SUPPLY (V)
Figure 8. Output Power versus Power Supply
Figure 9. THD+N versus Frequency
1 VP = 3.0 V RL = 8 W POUT = 250 mW THD+N (%) THD+N (%)
1 VP = 5.0 V RL = 8 W POUT = 500 mW
0.1
0.1
0.01 100
1000 FREQUENCY (Hz)
10000
0.01 100
1000 FREQUENCY (Hz)
10000
Figure 10. THD+N versus Frequency
Figure 11. THD+N versus Frequency
-40 CBYP = 100 nF VP = 3.6 V RL = 8 W Input to GND RIN = 22 k, RF = 22 k PSSR (dB)
-20 VP = 3.6 V RL = 8 W Input to GND RIN = 22 k, RF = 110 k
-30 CBYP = 100 nF 220 nF 440 nF -50 1.0 mF 2.2 mF -60
PSSR (dB)
-40
-60
CBYP = 220 nF
CBYP = 1.0 mF
-80 10
100
1000
10000
-70 10
100
1 000
10000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12. PSRR versus Frequency and CBYP @ VP = 3.6 V, AV = 2
Figure 13. PSRR versus Frequency and CBYP @ VP = 3.6 V, AV = 10
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NCP2990
TYPICAL PERFORMANCE CHARACTERISTICS
-40 VP = 3.0 V RL = 8 W Input to GND -40 VP = 3.6 V RL = 8 W Input to GND AV = 10
-50 PSSR (dB)
AV = 10 AV = 4 PSSR (dB)
-50
-60
-60
AV = 4
-70 AV = 2 -80 10 100 1000 10000
-70 AV = 2 -80 10 100 1000 10000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 14. PSRR versus Frequency and Gain @ VP = 3.0 V
Figure 15. PSRR versus Frequency and Gain @ VP = 3.6 V
-20 -30 -40 PSSR (dB) TON (ms) -50 -60 -70 -80 -90 -100 10 100 1000 10000 AV = 2 AV = 10 AV = 4 VP = 4.2 V RL = 8 W Input to GND
80 70 60 50 40 30 20 10 0 -40 -20 0 20 40 60 80 100
FREQUENCY (Hz)
ROOM TEMPERATURE (C)
Figure 16. PSRR versus Frequency and Gain @ VP = 4.2 V
Figure 17. Turn On Time versus Room Temperature @ VBAT = 3.6 V, CBYP = 1 mF, CIN = 100 nF, RIN = 22 k, RF = 110 k
120 100 80 TON (ms) 60 40 20 0 0 0.5 1 1.5 2 2.5 CBYP (mF)
Figure 18. Turn On Time versus CBYP @ VBAT = 3.6 V, TA = +255C, CIN = 100 nF, RIN = 22 k, RF = 110 k http://onsemi.com
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NCP2990
TYPICAL PERFORMANCE CHARACTERISTICS
0.7 PD, POWER DISSIPATION (W) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1 1.2 Pout, OUTPUT POWER (W) Vp = 5 V RL = 8 W F = 1 kHz THD + N < 0.1% PD, POWER DISSIPATION (W) 0.3 0.25 0.2 0.15 0.1 0.05 0 0 0.1 0.2 0.3 0.4 0.5 Pout, OUTPUT POWER (W) Vp = 3.3 V RL = 8 W F = 1 kHz THD + N < 0.1%
Figure 19. Power Dissipation versus Output Power
0.25 PD, POWER DISSIPATION (W) PD, POWER DISSIPATION (W) 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 0 0 0.1 0.2 0.3 0.4
Figure 20. Power Dissipation versus Output Power
0.2
RL = 4 W
0.15 Vp = 3 V RL = 8 W F = 1 kHz THD + N < 0.1%
RL = 8 W
0.1
0.05 0 Pout, OUTPUT POWER (W)
Vp = 2.6 V F = 1 kHz THD + N < 0.1% 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4
Pout, OUTPUT POWER (W)
Figure 21. Power Dissipation versus Output Power
Figure 22. Power Dissipation versus Output Power
180
700 PD, POWER DISSIPATION (mW) 600 200 mm2 500 50 mm2 400 300 200 100 0 0 PDmax = 633 mW for Vp = 5 V, RL = 8 W 20 40 60 80 100 120 140 500 mm2 PCB Heatsink Area DIE TEMPERATURE (C) @ AMBIENT TEMPERATURE 25C
160 140 120 100 80 60 40 Vp = 2.6 V 50 100 Vp = 4.2 V
Maximum Die Temperature 150C RL = 8 W Vp = 5 V
Vp = 3.3 V
160
150
200 (mm2)
250
300
TA, AMBIENT TEMPERATURE (C)
PCB HEATSINK AREA
Figure 23. Power Derating - 9-Pin Flip-Chip CSP
Figure 24. Maximum Die Temperature versus PCB Heatsink Area
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NCP2990
APPLICATION INFORMATION
Detailed Description Shutdown Function
The NCP2990 audio amplifier can operate under 2.6 V until 5.5 V power supply. With less than 1% THD + N, it can deliver up to 1.2 W RMS output power to an 8.0 W load (VP = 5.0 V). If application allows to reach 10% THD + N, then 1.6 W can be provided using a 5.0 V power supply. The structure of the NCP2990 is basically composed of two identical internal power amplifiers; the first one is externally configurable with gain-setting resistors Rin and Rf (the closed-loop gain is fixed by the ratios of these resistors) and the second is internally fixed in an inverting unity-gain configuration by two resistors of 20 kW. So the load is driven differentially through OUTA and OUTB outputs. This configuration eliminates the need for an output coupling capacitor.
Internal Power Amplifier
The device enters shutdown mode when shutdown signal is low. During the shutdown mode, the DC quiescent current of the circuit does not exceed 100 nA. In this configuration, the output impedance is 10 kW on each output.
Current Limit Circuit
The maximum output power of the circuit (Porms = 1.0 W, Vp = 5.0 V, RL = 8.0 W) requires a peak current in the load of 500 mA. In order to limit the excessive power dissipation in the load when a short-circuit occurs, the current limit in the load is fixed to 800 mA. The current in the four output MOS transistors are real-time controlled, and when one current exceeds 800 mA, the gate voltage of the MOS transistor is clipped and no more current can be delivered.
Thermal Overload Protection
The output PMOS and NMOS transistors of the amplifier were designed to deliver the output power of the specifications without clipping. The channel resistance (Ron) of the NMOS and PMOS transistors does not exceed 0.6 W when they drive current. The structure of the internal power amplifier is composed of three symmetrical gain stages, first and medium gain stages are transconductance gain stages to obtain maximum bandwidth and DC gain.
Turn-On and Turn-Off Transitions
A cycle with a turn-on and turn-off transition is illustrated with plots that show both single ended signals on the previous page. In order to eliminate "pop and click" noises during transitions, output power in the load must be slowly established or cut. When logic high is applied to the shutdown pin, the bypass voltage begins to rise exponentially and once the output DC level is around the common mode voltage, the gain is established instantaneously. This way to turn-on the device is optimized in terms of rejection of "pop and click" noises. The device has the same behavior when it is turned-off by a logic low on the shutdown pin. During the shutdown mode, amplifier outputs are connected to the ground using a 10 kW pulldown resistor. When a shutdown low level is applied, with 1 mF bypass capacitor, it takes 65 ms before the DC output level is tied to Ground on each output. However, no audio signal will be provided to the BTL load instantaneously after the falling edge on the shutdown pin. With 1 mF bypass capacitor, turn on time is set to 60 ms. Refer to Figures 17 and 18 for a complete study of this parameter. This fast turn on time added to a very low shutdown current saves battery life and brings flexibility when designing the audio section of the final application. NCP2990 is a zero pop noise device when using a single-ended audio input.
Internal amplifiers are switched off when the temperature exceeds 160C, and will be switched on again only when the temperature decreases fewer than 140C. The NCP2990 is unity-gain stable and requires no external components besides gain-setting resistors, an input coupling capacitor and a proper bypassing capacitor in the typical application. The first amplifier is externally configurable (Rf and Rin), while the second is fixed in an inverting unity gain configuration. The differential-ended amplifier presents two major advantages: - The possible output power is four times larger (the output swing is doubled) as compared to a single-ended amplifier under the same conditions. - Output pins (OUTA and OUTB) are biased at the same potential Vp/2, this eliminates the need for an output coupling capacitor required with a single-ended amplifier configuration. The differential closed loop-gain of the amplifier is given by Avd + 2 *
Porms + V Rf + orms . Rin Vinrms
Output power delivered to the load is given by
(Vopeak)2 (Vopeak is the peak differential 2 * RL
output voltage). When choosing gain configuration to obtain the desired output power, check that the amplifier is not current limited or clipped. The maximum current which can be delivered to the load is 500 mA Iopeak +
Vopeak . RL
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NCP2990
Gain-Setting Resistor Selection (Rin and Rf)
high-pass filter with Rin, the cut-off frequency is given by
fc + 1 . 2 * P * Rin * Cin
Rin and Rf set the closed-loop gain of the amplifier. In order to optimize device and system performance, the NCP2990 should be used in low gain configurations. The low gain configuration minimizes THD + noise values and maximizes the signal to noise ratio, and the amplifier can still be used without running into the bandwidth limitations. A closed loop gain in the range from 2 to 5 is recommended to optimize overall system performance. An input resistor (Rin) value of 22 kW is realistic in most of applications, and doesn't require the use of a too large capacitor Cin.
Input Capacitor Selection (Cin)
The size of the capacitor must be large enough to couple in low frequencies without severe attenuation. An input capacitor value between 33 nF and 220 nF performs well in many applications (With Rin = 22 KW).
Bypass Capacitor Selection (Cby)
The bypass capacitor Cby provides half-supply filtering and determines how fast the NCP2990 turns on. With a single-ended audio input, the amplifier will be a zero pop noise device no matter the bypass capacitor.
The input coupling capacitor blocks the DC voltage at the amplifier input terminal. This capacitor creates a
C2* AUDIO INPUT J12 C1 J3* R1
R2 20 kW
1 mF
C4 Vp OUTA 20 kW
J11
INM INP Vp
100 nF 20 kW
- +
8W - + 20 kW OUTB J5
Vp BYPASS J6 TP1* TP2* TP3* SHUTDOWN 150 kW R3 VM_P C3 1 mF
SHUTDOWN CONTROL VM
J7
Vp OUTA OUTB
J8
*C2, TP1, TP2, and TP3: Not Mounted
Figure 25. Schematic of the NCP2990 Demonstration Board
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NCP2990
Figure 26. Demonstration Board for 9-Pin Flip-Chip CSP Device - Silkscreen Layers
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NCP2990
BILL OF MATERIAL
Item 1 2 4 5 6 7 8 9 10 Part Description NCP2990 Audio Amplifier SMD Resistor 20 KW SMD Resistor 150 KW Ceramic Capacitor 47 nF 100 V X7R Ceramic Capacitor 1.0 mF 10 V X7R Jumper Header Vertical Mount, 2 positions, 100 mils I/O Connector, 2 positions Jumper Connector Not Mounted Ref. - R1, R2 R3 C1 C3, C4 J2, J6, J18 J1, J5 J7 C2, TP1, TP2, TP3 PCB Footprint - 0805 0805 0805 0805 100 mils 200 mils 400 mils - Manufacturer ON Semiconductor Panasonic Panasonic TDK TDK Tyco Electronics / AMP Phoenix Contact Harwin - Manufacturer Reference NCP2990 ERJ-6GEYJ203V ERJ-6GEYJ203V C2012X7R2A473K C2012X7R1A105K 5-826629-0 1757242 D3082-B01 -
ORDERING INFORMATION
Device NCP2990FCT2G Marking MBA Package 9-Pin Flip-Chip CSP (Pb-Free) Shipping 3000/T ape and Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: The NCP2990AFCT2G version requires a lead-free solder paste and should not be used with a SnPb solder paste.
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NCP2990
PACKAGE DIMENSIONS
9 PIN FLIP-CHIP CASE 499E-01 ISSUE A
4X
-A- D -B- E
0.10 C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX 0.540 0.660 0.210 0.270 0.330 0.390 1.450 BSC 1.450 BSC 0.290 0.340 0.500 BSC 1.000 BSC 1.000 BSC
TOP VIEW 0.10 C 0.05 C -C-
SEATING PLANE
A
DIM A A1 A2 D E b e D1 E1
A2 A1 SIDE VIEW D1 e
C B
e
A 9X
E1
b
1
2
3
0.05 C A B 0.03 C BOTTOM VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NCP2990/D

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